Substrate processing apparatus and substrate processing method
AssigneeTokyo Electron Limited
InventorsAkihiro Teramoto, Tokutarou Hayashi
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AssigneeTokyo Electron Limited
InventorsAkihiro Teramoto, Tokutarou Hayashi
Estimating the term…
A technique which, when transporting a substrate from one module to another, detects a displacement of the substrate on a holding member and transfers the substrate to another module with the displacement within an acceptable range. Displacement of a wafer on a fork of a transport arm from a reference position is determined when the fork has received the wafer from one module and, when the displacement is within an acceptable range, the wafer is transported by the transport arm to another module. When the displacement is out of the acceptable range, the wafer is transported by the transport arm to a wafer stage module, and then the transport arm receives the wafer from the wafer stage module so that the displacement comes to fall within the acceptable range. The wafer can therefore be transferred to another module with the displacement within the acceptable range.
A substrate processing apparatus comprising:
A substrate processing method for carrying out processing of a substrate while transporting the substrate from one module to another module by a substrate transport mechanism including, the substrate transport mechanism comprises a horizontally movable holding member for holding a substrate and is provided in an area other than the one module and the another module, said method comprising the steps of:
Dependencies are inferred from the claim text.