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US 9,258,892 B2Granted
Circuit materials, circuits laminates, and method of manufacture thereof
AssigneeRogers Corporation
InventorJessica Crosley
Life of this patent
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Abstract
A circuit subassembly is disclosed comprising a conductive metal layer and a dielectric substrate layer having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006 at 10 GHz, wherein the composition of the dielectric substrate layer comprises about 5 to about 70 volume percent of borosilicate microspheres that have been treated with an alkaline solution.
Claims34
A circuit subassembly, comprising
- a conductive layer disposed on a dielectric substrate layer, wherein the composition of the dielectric substrate layer comprises, based on the volume of the dielectric substrate layer:
- about 30 to about 90 volume percent of a polymer matrix material;
- and
- about 5 to about 70 volume percent of hollow borosilicate microspheres
- wherein the borosilicate microspheres are a product of a process of subjecting the borosilicate microspheres to an alkaline solution;
- and wherein the dielectric substrate layer has a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006 at 10 GHz.
3 more elements
A method of making a circuit subassembly, the method comprising:
- treating hollow borosilicate microspheres with an alkaline solution;
- combining the hollow borosilicate microspheres with a polymer matrix material to form a dielectric composite material;
- forming a layer of the dielectric composite material, thereby obtaining a dielectric substrate layer;
- disposing a conductive layer on the dielectric substrate layer;
- and
- laminating the dielectric substrate layer and the conductive layer, wherein the dielectric substrate layer exhibits a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006 at 10 GHz.
3 more elements
Dependencies are inferred from the claim text.