Systems and methods for providing data channels at a die-to-die interface

A method comprising:

• providing parallel binary data to a plurality of data nodes on a first die and to a plurality of data nodes on a second die, wherein individual ones of the plurality of data nodes on the first die correspond to respective ones of the data nodes on the second die, and wherein each of the data nodes on the first die is associated with a bit of the parallel binary data;
• and
• for each one of the bits of the parallel binary data:
• receiving the clock at a sequential logic circuit of a first plurality of sequential logic circuits arranged along one side of a die-to-die subsystem of the first die;
• in response to receiving the clock at the sequential logic circuit, transmitting a respective bit of the data from the sequential logic circuit along a physical route on the first die to a respective one of the data nodes on the first die, along a die-to-die channel to a respective one of the data nodes on the second die, and from the respective one of the data nodes on the second die to a sequential logic circuit of a second plurality of sequential logic circuits on the second die, wherein the second plurality of sequential logic circuits is arranged along one side of a die-to-die subsystem of the second die that is different from the one side of the die-to-die subsystem of the first die;
• and
• capturing the respective bit of the data by the sequential logic circuit of the second plurality of sequential logic circuits in response to receiving the clock.

A multi-die package comprising:

• a first die having a first clock tree feeding a first plurality of flip flops, the first die further having a first array of exposed data nodes, wherein individual ones of the first plurality of flip-flops correspond to individual ones of the first array of exposed data nodes;
• and
• a second die having a second clock tree feeding a second plurality of flip flops, the second die further having a second array of exposed data nodes, wherein individual ones of the second plurality of flip-flops correspond to individual ones of the second array of exposed data nodes;
• wherein individual ones of the first plurality of exposed data nodes correspond to, and are in communication with, individual ones of the second plurality of exposed data nodes to pass a plurality of parallel data bits, the first array of exposed data nodes and the second array of exposed data nodes conforming to a common spatial arrangement of data nodes;
• further wherein the first plurality of flip-flops is disposed on a first side of the first array, and the second plurality of flip-flops is disposed on a second side of the second array, the first and second sides having a right-hand versus left-hand relationship.

A method for providing parallel data bits in a multi-die package having a first die in communication with a second die, the method comprising:

• providing parallel binary data to a plurality of transmit flip-flops on the first die;
• transmitting the parallel binary data from the plurality of transmit flip-flops to a plurality of receive flip-flops on the second die;
• and
• capturing the parallel data at the plurality of receive flip-flops;
• wherein transmitting the parallel binary data comprises, for each individual bit of the parallel data:
• propagating the bit of data on the first die along a first on-die data route;
• and
• propagating the bit of data on the second die along a second on-die data route, wherein the first on-die data route and the second on-die data route have different lengths;
• wherein a length sum of the first on-die data route and the second on-die data route is uniform for each bit of the parallel data.