Activated thread curing of liquid adhesives
AssigneeApple Inc.
InventorsSamuel T. Reineman, Kevin D. Gibbs, Amy Qian, Derek W. Wright
Life of this patent
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AssigneeApple Inc.
InventorsSamuel T. Reineman, Kevin D. Gibbs, Amy Qian, Derek W. Wright
Estimating the term…
Structures and methods for providing a liquid adhesive between substrates of a composite structure are described. Methods include providing a liquid adhesive having a thread disposed therein between two substrates of a composite structure. In some embodiments, the thread has a fixed diameter which acts to provide a consistent gap between the two substrates. In some embodiments, the thread is configured to be activated during the assembly process to facilitate curing of the liquid adhesive. In some embodiments the thread is configured to be activated after the composite structure is formed to facilitate separation of the two substrates and disassembly of the composite structure. The thread can be made of a conductive or non-conductive material. In some embodiments, the thread is activated by passing a voltage through the thread to heat the thread. In some embodiments, the thread is activated by passing ultraviolet light through the thread.
A method of forming a composite structure having a first substrate and a second substrate, comprising:
A composite structure, comprising:
A method of forming a composite structure having a first substrate and a second substrate, comprising:
Dependencies are inferred from the claim text.