Method for integrating a light emitting device
AssigneeLuxVue Technology Corporation
InventorsAndreas Bibl, Charles R. Griggs
Life of this patent
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Abstract
Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.
Claims22
A method for integrating a light emitting device comprising:
- picking up a micro LED device from a carrier substrate with a transfer head;
- placing the micro LED device on a receiving substrate;
- releasing the micro LED device from the transfer head;
- applying a passivation layer over the receiving substrate and laterally around the micro LED device;
- hardening the passivation layer;
- and
- etching the passivation layer, such that a top surface of the micro LED device and a top surface of a conductive line on the receiving substrate are not covered by the passivation layer, and a portion of the micro LED device and the conductive line protrude above a top surface of the passivation layer after etching the passivation layer.
A method for integrating a light emitting device comprising:
- applying a passivation layer over a receiving substrate;
- picking up a micro LED device from a carrier substrate with a transfer head;
- placing the micro LED device on the receiving substrate, wherein placing the micro LED device on the receiving substrate comprises punching the micro LED device through the passivation layer;
- releasing the micro LED device from the transfer head;
- hardening the passivation layer;
- and
- etching the passivation layer, such that a top surface of the micro LED device and a top surface of a conductive line on the receiving substrate are not covered by the passivation layer, and a portion of the micro LED device and the conductive line protrude above the top surface of the passivation layer after etching the passivation layer.
A light emitting device comprising:
- a bank layer;
- a bank structure within the bank layer;
- a conductive line atop the bank layer and elevated above the bank structure;
- a micro LED device within the bank structure;
- and
- a passivation layer that spans directly over the bank layer and within the bank structure such that a portion of the passivation layer within the bank structure is laterally around the micro LED device, wherein a portion of the micro LED device and the conductive line atop the bank layer protrude above a top surface of the passivation layer.
Dependencies are inferred from the claim text.