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US 9,230,940 B2Granted
Three-dimensional chip stack for self-powered integrated circuit
AssigneeGlobalfoundries Inc.
InventorsKenneth J. Goodnow, Todd E. Leonard, Stephen G. Shuma, Peter A. Twombly
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Abstract
Structures and methods for self-powered devices are disclosed herein. Specifically, disclosed herein is a stacked, three-dimensional integrated circuit including a power generation die including a power source. The integrated circuit also includes a functional system die including one or more functional components that are powered by power generated by the power source. The power generation die and the functional system die are stacked in a three-dimensional structure.
Claims10
A stacked three-dimensional integrated circuit, comprising:
- a power generation die including a power source;
- a power storage and control die including a power controller and one or more storage devices that store power received from the power source;
- and
- a functional system die including one or more functional components that are powered by power generated by the power source,
- wherein the power generation die and the functional system die are stacked in a three-dimensional structure.
2 more elements
Dependencies are inferred from the claim text.