Substrate treatment method

A substrate treatment method for treating a substrate with a treatment liquid, the substrate treatment method comprising:

• an initial preparation step of controlling a liquid surface level of a treatment liquid retained in a treatment vessel at a first liquid surface level, and then causing a first circulation unit to circulate the treatment liquid from the treatment vessel through a first circulation path while controlling a temperature of the treatment liquid by a temperature controller disposed in the first circulation path, thereby divergently spouting in air in the treatment vessel the treatment liquid circulated by the first circulation unit and temperature-controlled by the temperature controller from a first spouting portion located above the first liquid surface level, the first liquid surface level being set lower than a lower portion of a substrate held at a substrate treatment position for treatment with the treatment liquid in the treatment vessel so as to prevent the treatment liquid retained in the treatment vessel from contacting the substrate held at the substrate treatment position;
• a substrate loading step of loading the substrate into the treatment vessel from outside thereof and holding the substrate at the substrate treatment position, after the initial preparation step;
• a substrate treatment step of spouting the treatment liquid circulated by the first circulation unit and temperature-controlled by the temperature controller from the first spouting portion located above the first liquid surface level toward the substrate held at the substrate treatment position in air in the treatment vessel while controlling the temperature of the treatment liquid by the temperature controller disposed in the first circulation path;
• and
• the step of cleaning the treatment liquid by a filter disposed in the first circulation path through which the treatment liquid is circulated by the first circulation unit.