Method and apparatus for machining strengthened glass and articles produced thereby
AssigneeElectro Scientific Industries, Inc.
InventorsHisashi Matsumoto, Haibin Zhang, Glenn Simenson
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Abstract
Methods and apparatus for machining substrates are disclosed, as are articles formed from the separated substrates. A method of machining a substrate having a first surface and a second surface opposite the first surface can include forming a first recess in the substrate extending from the first surface toward the second surface, forming a second recess in the substrate extending from the second surface toward the first surface, and removing a portion of the substrate extending from the first recess to the second recess to form an opening in the substrate.
Claims23
A method, comprising:
- providing a strengthened glass substrate having a first surface, a second surface, a first compression region, a second compression region, and a tension region, wherein the second surface is opposite the first surface, wherein the first compression region extends from the first surface to toward the second surface, wherein the first compression region has a first compression depth of layer at which the strengthened glass substrate exhibits zero stress, wherein the second compression region extends from the second surface toward the first surface, wherein the second compression region has a second compression depth of layer at which the strengthened glass substrate exhibits zero stress, and wherein the tension region is arranged between the first compression region and the second compression region;
- producing a focused beam of laser light;
- directing the focused beam of laser light to form a first recess in the substrate, wherein the first recess extends from the first surface toward the second surface to a first depth that is less than or equal to 200% of the first compression depth;
- directing the focused beam of laser light to form a second recess in the substrate, wherein the second recess extends from the second surface toward the first surface to a second depth that is less than or equal to 200% of the second compression depth;
- and
- directing the focused beam of laser light to remove a portion of the substrate extending from the first recess to the second recess to form an opening in the substrate by ablation, wherein the opening extends from the first surface to the second surface.
A method of forming an opening in a strengthened glass substrate having a first compression region, a second compression region and a tension region arranged between the first compression region and the second compression region, the method comprising:
- producing a focused beam of laser light;
- directing the focused beam of laser light to remove a first portion of the substrate disposed within the first compression region, wherein the first compression region has a first compression depth of layer at which the strengthened glass substrate exhibits zero stress, and wherein the first portion has a first depth that is less than or equal to 200% of the first compression depth;
- directing the focused beam of laser light to remove a second portion of the substrate disposed within the second compression region, wherein the second compression region has a second compression depth of layer at which the strengthened glass substrate exhibits zero stress, and wherein the second portion has a second depth that is less than or equal to 200% of the second compression depth;
- and
- after removing the first portion and the second portion, directing the focused beam of laser light to remove a third portion of the substrate disposed within the tension region to form the opening by ablation.
Dependencies are inferred from the claim text.