Making multi-layer micro-wire structure
AssigneeEastman Kodak Company
InventorsHwei-Ling Yau, David Paul Trauernicht, John Andrew Lebens, Yongcai Wang, Ronald Steven Cok
Life of this patent
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Abstract
A method of making a multi-layer micro-wire structure includes providing a substrate having a surface and forming a plurality of micro-channels in the surface. A first material composition is located in a first layer only in each micro-channel and not on the surface. A second material composition different from the first material composition is located in a second layer different from the first layer only in each micro-channel and not on the surface. The first material composition in the first layer and the second material composition in the second layer form an electrically conductive multi-layer micro-wire in each micro-channel.
Claims15
A method of making a multi-layer micro-wire structure, comprising:
- providing a substrate having a surface;
- forming a plurality of micro-channels in the substrate;
- locating a first material composition in a first layer only in each micro-channel and not on the substrate surface by coating the first material composition over the substrate surface and micro-channels, removing the first material composition from the substrate surface and not the micro-channels, and curing the first material composition into the first layer;
- locating a second material composition different from the first material composition in a second layer different from and in contact with the first layer only in each micro-channel and not on the substrate surface by coating the second material composition over the substrate surface, first layer, and micro-channels, removing the second material composition from the substrate surface and not the micro-channels or first layer, and curing the second material composition into the second layer;
- and
- wherein:
- the first layer and the second layer have different structures;
- the first material composition in the first layer is electrically conductive and the second material composition in the second layer is electrically conductive;
- and
- the first material composition in the first layer and the second material composition in the second layer form an electrically conductive multi-layer micro-wire in each micro-channel.
A method of making a multi-layer micro-wire structure, comprising:
- providing a substrate having a surface;
- forming a plurality of micro-channels in the substrate;
- locating a first material composition in a first layer only in each micro-channel and not on the substrate surface by coating the first material composition over the substrate surface and micro-channels, removing the first material composition from the substrate surface and not the micro-channels, and curing the first material composition into the first layer;
- locating a second material composition different from the first material composition in a second layer different from and in contact with the first layer only in each micro-channel and not on the substrate surface by coating the second material composition over the substrate surface, first layer, and micro-channels, removing the second material composition from the substrate surface and not the micro-channels or first layer, and curing the second material composition into the second layer;
- and
- wherein:
- the first layer and the second layer have different material attributes;
- the first material composition in the first layer is electrically conductive and the second material composition in the second layer is electrically conductive;
- and
- the first material composition in the first layer and the second material composition in the second layer form an electrically conductive multi-layer micro-wire in each micro-channel.
Dependencies are inferred from the claim text.