Distributed multi-stage switch fabric

A method, comprising:

• sending a first cell of data, via at least a midplane that is disposed within a first chassis, from a module associated with a first stage of a switch fabric and situated on a first interface card in the first chassis, a first processor situated on the first interface card and associated with the first stage of the switch fabric, to a first module associated with a second stage of the switch fabric on a second interface card including a second processor associated with the first module associated with the second stage of the switch fabric, the second interface card including the first module associated with the second stage being within the first chassis;
• and
• sending a second cell of data, via at least the midplane and a cable, from the module associated with the first stage of the switch fabric to a second module associated with the second stage of the switch fabric and situated on a third interface card in a second chassis different from the first chassis, a third processor situated on the third interface card and associated with the second module associated with the second stage of the switch fabric,
• the first interface card not including a module associated with the second stage of the switch fabric, and the second interface card and the third interface card not including a module associated with the first stage of the switch fabric.

A system, comprising:

• a first module associated with a first stage of a switch fabric;
• a third module associated with a third stage of the switch fabric, the first module associated with the first stage of the switch fabric and the third module associated with the third stage of the switch fabric being disposed on a first interface card within a first chassis, the first interface card including a first processor associated with the first module associated with the first stage of the switch fabric and the third module associated with the third stage of the switch fabric, the first interface card not including a second module associated with a second stage of the switch fabric;
• and
• the second module associated with the second stage of the switch fabric being operatively coupled to the module associated with the first stage of the switch fabric via a cable and a midplane and disposed on a second interface card within a second chassis different from the first chassis, the second interface card including a second processor associated with the second module associated with the second stage of the switch fabric the second interface card not including a first module associated with the first stage of the switch fabric or a third module associated with the third stage of the switch fabric,
• the first module associated with the first stage of the switch fabric, the second module associated with the second stage of the switch fabric, and the third module associated with the third stage of the switch fabric defining a first data path between an input module and an output module.