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US 9,221,955 B2Granted
Prepreg and carbon fiber reinforced composite materials
AssigneeToray Industries, Inc.
InventorsNobuyuki Arai, Norimitsu Natsume, Kenichi Yoshioka, Junko Kawasaki, Hiroshi Takezaki
Life of this patent
Estimating the term…
Abstract
A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.
Claims12
A prepreg comprising:
- a carbon fiber (A), a thermosetting resin (B), thermoplastic resin particles (C) and at least one type of conductive particles (D) selected from the group consisting of carbon particles, particles having a nucleus of inorganic material coated with a conductive substance and particles having a nucleus of organic material coated with a conductive substance,
- wherein a weight ratio expressed by (content of (C) (parts by weight))/(content of (D) (parts by weight)) is 1 to 1000, and the conductive particles (D) have an average particle diameter equal to or larger than an average particle diameter of the thermoplastic resin particles (C),
- wherein the thermoplastic resin particles (C) and the conductive particles (D) are localized on the surface of the carbon fiber layer (A), and
- wherein 90 to 100 wt % of each of the thermoplastic resin particles (C) and the conductive particles (D) is localized in a 20% depth range from both surfaces of the prepreg in the thickness direction.
1 more element
Dependencies are inferred from the claim text.