Back to results
US 9,220,852 B2Granted
Method for producing trench-like depressions in the surface of a wafer
AssigneeBoehringer Ingelheim Microparts GmbH
InventorKlaus Kadel
Life of this patent
Estimating the term…
Abstract
In a method of producing trench-like depressions in the surface of a wafer, particularly a silicon wafer, by plasma etching, in which the depressions are produced by alternate passivation and etching, each depression in its final geometry is provided with a protective layer of the polytetrafluoroethylene type.
Claims12
A method for producing a micro-nozzle having trench-like depressions (24) in the surface of a wafer (27) by plasma etching, comprising:
- (a) applying a plasma polymer layer of less than about 10 nm thick to respective portions of the wafer (27) to operate as a passivation layer;
- (b) etching the wafer (27) such that the passivation layer is removed and respective depth portions of the wafer (27), formerly under the passivation layer, are removed, thereby forming respective portions of the trench-like depressions (24) in the wafer (27);
- (c) applying a further plasma polymer layer of less than about 10 nm thick to respective surfaces within a plurality of the trench-like depressions (24), to operate as a further passivation layer;
- (d) etching the wafer (27) again such that the further passivation layer is removed and further respective depth portions of the wafer (27), formerly under the further passivation layer, are removed, thereby further forming the trench-like depressions (24) in the wafer (27);
- (e) repeating steps (c) through (d) a plurality of times until the trench-like depressions (24) are of a predetermined depth;
- (f) applying a final layer of polytetrafluoroethylene type material, greatly exceeding the thickness of the further passivation layer, to all surfaces of the wafer (27) within the plurality of the trench-like depressions (24) to operate as a protective layer (30).
3 more elements
A micronozzle, comprising:
- a wafer (27), formed from a silicon plate (25) or a glass plate, comprising trench-like depressions (24) through one surface of, and into, the wafer (27),
- a cover, formed from a glass plate (26) or a silicon plate, covering the depressions (24), and which is attached to the wafer (27) by anodic bonding, and
- a protective layer (30) of polytetrafluoroethylene type material covering all surfaces of the wafer (27) within the depressions (24).
A nebuliser for dispensing a specified amount of a fluid as an aerosol, comprising:
- a micronozzle having:
- a wafer (27), formed from a silicon plate (25) or a glass plate, comprising trench-like depressions (24) through one surface of, and into, the wafer (27),
- a cover, formed from a glass plate (26) or a silicon plate, covering the depressions (24), and which is attached to the wafer (27) by anodic bonding, and
- a protective layer (30) of polytetrafluoroethylene type material covering all surfaces of the wafer (27) within the depressions (24).
1 more element
Dependencies are inferred from the claim text.