Flowable carbon film by FCVD hardware using remote plasma PECVD
AssigneeApplied Materials, Inc.
InventorAmit Chatterjee
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Abstract
Embodiments of the present invention generally relate to methods for forming a flowable carbon-containing film on a substrate. In one embodiment, an oxygen-containing gas is flowed into a remote plasma region to produce oxygen-containing plasma effluents, and a carbon-containing gas is combined with the oxygen-containing plasma effluents in a substrate processing region which contains the substrate. A carbon-containing film is formed in trenches which are formed on the substrate and a low K dielectric material is deposited on the carbon-containing film in the trenches. The carbon-containing film is decomposed by an UV treatment and airgaps are formed in the trenches under the low K dielectric material.
Claims20
A method for forming airgaps in trenches formed on a substrate, comprising:
- forming a flowable carbon-containing film in a first portion of the trenches, comprising:
- providing a carbon-containing gas to a substrate processing region in a chemical vapor deposition chamber;
- providing an oxygen-containing gas to a remote plasma system to form oxygen-containing plasma effluents;
- introducing the plasma effluents into the substrate processing region;
- and
- reacting the plasma effluents and the carbon-containing gas to form the flowable carbon-containing film in the first portion of the trenches;
- forming a low K dielectric material on the flowable carbon-containing film in a second portion of the trenches;
- and
- removing the flowable carbon-containing film to form the airgaps in the first portion of the trenches.
A method for forming airgaps in trenches formed on a substrate, comprising:
- forming a flowable poly(methyl methacrylate) film in a first portion of the trenches, comprising:
- providing a methyl methacrylate gas to a substrate processing region in a chemical vapor deposition chamber;
- forming an argon and oxygen-containing plasma effluents in a plasma region distinct from the substrate processing region in the chemical vapor deposition chamber;
- introducing the plasma effluents into the substrate processing region;
- and
- reacting the plasma effluents and the methyl methacrylate gas to form the flowable poly(methyl methacrylate) film in the first portion of the trenches;
- and
- removing the flowable poly(methyl methacrylate) film to form the airgaps in the first portion of the trenches.
A method for forming airgaps in trenches formed on a substrate, comprising:
- forming a flowable carbon-containing film in a first portion of the trenches, comprising:
- providing a carbon-containing gas to a substrate processing region in a chemical vapor deposition chamber, wherein the carbon-containing gas does not contain silicon;
- providing an oxygen-containing gas to a remote plasma system to form oxygen-containing plasma effluents;
- introducing the plasma effluents into the substrate processing region;
- and
- reacting the plasma effluents and the carbon-containing gas to form the flowable carbon-containing film in the first portion of the trenches;
- forming a low K dielectric material on the flowable carbon-containing film in a second portion of the trenches;
- and
- removing the flowable carbon-containing film to form the airgaps in the first portion of the trenches.
Dependencies are inferred from the claim text.