Methods for forming semiconductor device packages

A method for forming a semiconductor device package, the method comprising:

• applying an underfill material over a semiconductor wafer including conductive elements on a major surface thereof to an average thickness of the underfill material of at least about eighty percent (80%) of an average height of the conductive elements, wherein the underfill material covers at least a substantial number of the conductive elements;
• planarizing each of the conductive elements and forming an exposed planar surface of each of the conductive elements above planar surfaces of the underfill material between adjacent conductive elements without reducing the average thickness of the underfill material to less than about eighty percent (80%) of the average height of the conductive elements prior to application of the underfill material over the semiconductor wafer to remove underfill material covering tips of the conductive elements;
• attaching conductive elements of at least one semiconductor die of the semiconductor wafer to bond pads of a substrate;
• electrically connecting bond pads of the at least one semiconductor die on a side of the at least one semiconductor die opposite the conductive elements of the at least one semiconductor die with a conductive via;
• and
• attaching conductive elements of another semiconductor die with the bond pads of the at least one semiconductor die.