Fully integrated and encapsulated micro-fabricated vacuum diode and method of manufacturing same
AssigneeSandia Corporation
InventorsPaul J. Resnick, Eric Langlois
Life of this patent
Estimating the term…
Abstract
Disclosed is an encapsulated micro-diode and a method for producing same. The method comprises forming a plurality columns in the substrate with a respective tip disposed at a first end of the column, the tip defining a cathode of the diode; disposing a sacrificial oxide layer on the substrate, plurality of columns and respective tips; forming respective trenches in the sacrificial oxide layer around the columns; forming an opening in the sacrificial oxide layer to expose a portion of the tips; depositing a conductive material in of the opening and on a surface of the substrate to form an anode of the diode; and removing the sacrificial oxide layer.
Claims12
An encapsulated micro diode comprising:
- a plurality of columnar portions formed from a substrate having a pyramidal tip at a first end forming a cathode of the diode;
- an insulation layer disposed between adjacent ones of the columnar portions, the insulation layer overlying the columnar portion and having an aperture therethrough in a region overlying respective ones of the tips;
- a conformal anode disposed above the cathode, wherein the anode conforms to a shape of the pyramidal tip;
- and
- an encapsulation metal disposed on a surface of the insulation layer.
An encapsulated micro diode comprising:
- a plurality of columnar portions formed from a substrate, wherein each columnar portion has a pyramidal tip at a first end forming a cathode of the diode;
- an insulation layer disposed between adjacent ones of the columnar portions, the insulation layer overlying the columnar portion and having a plurality of apertures therethrough, wherein each aperture overlies each of the pyramidal tips;
- a plurality of anodes, wherein each anode is disposed above each of the cathodes, wherein each of the anodes is a conformal anode that conforms to a shape of the pyramidal tip;
- and
- an encapsulation metal disposed on a surface of the insulation layer.
Dependencies are inferred from the claim text.