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US 9,197,796 B2Granted
Camera module
AssigneeLG Innotek Co., Ltd.
InventorsHyun Ah Oh, Youn Baek Jeong, Se Jin Lee
Life of this patent
Estimating the term…
Abstract
Exemplary embodiments of a camera module are proposed, the camera module including a PCB (Printed Circuit Board) mounted with an image sensor, a base installed at an upper surface of the PCB and formed with a window at a position corresponding to that of the image sensor, an IRCF (Infrared Cut Filter) installed at an upper surface of the base, and an adhesive member fixing the IRCF to the base.
Claims5
A camera module, the camera module comprising:
- a PCB (Printed Circuit Board) mounted with an image sensor;
- a base disposed at an upper surface of the PCB and formed with a window at a position corresponding to that of the image sensor;
- a yoke disposed at an upper surface of the base;
- a bobbin liftably disposed at the upper surface of the base, the bobbin moving in response to interaction with a magnet mounted on the yoke;
- an IRCF (Infrared Cut Filter) disposed at an upper surface of the base;
- and
- an adhesive agent fixing the IRCF to the base,
- wherein the adhesive agent includes:
- an adhesive section adhering the IRCF to the base, and
- a foreign object collection section free from contact with the IRCF, the foreign object collection section being configured to collect foreign objects generated by moving of the bobbin,
- wherein the adhesive agent is disposed on a concave groove of the base so formed as to have a depth corresponding to a thickness of the adhesive agent, and
- wherein an upper surface of the adhesive agent forms a flat plane with at least a portion of an upper surface of the base.
9 more elements
Dependencies are inferred from the claim text.