Forming magnetic microelectromechanical inductive components
AssigneeInternational Business Machines Corporation
InventorsWilliam J. Gallagher, Eugene J. O'Sullivan, Naigang Wang
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Abstract
A micro-electromechanical device and method of manufacture are disclosed. A sacrificial layer is formed on a silicon substrate. A metal layer is formed on a top surface of the sacrificial layer. Soft magnetic material is electrolessly deposited on the metal layer to manufacture the micro-electromechanical device. The sacrificial layer is removed to produce a metal beam separated from the silicon substrate by a space.
Claims8
A method of manufacturing a micro-electromechanical device, comprising:
- forming a metal layer of the micro-electromechanical device on a sacrificial layer of a wafer, wherein the sacrificial layer includes a portion of a substrate of the wafer;
- removing the sacrificial layer to produce a suspended metal beam coupled to at least one support structure of the wafer;
- and
- electrolessly depositing a soft magnetic material on the metal layer to manufacture the micro-electromechanical device.
A method of manufacture an inductive component of a micro-electromechanical device, comprising:
- forming a wafer substrate having a support structure;
- forming a metal layer coupled to the support structure on a sacrificial layer of the wafer, wherein the sacrificial layer includes a portion of a substrate of the wafer;
- removing the sacrificial layer;
- and
- electrolessly depositing a soft magnetic material on the metal layer to manufacture the inductive component.
Dependencies are inferred from the claim text.