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US 9,192,418 B2Granted
Laser processing apparatus, osseointegration method, implant material, and implant-material fabrication method
AssigneesNational University Corporation Hokkaido University, Mitsubishi Electric Corporation
InventorsMasaru Kanaoka, Taira Ogita, Tooru Murai, Shigeru Tadano, Masahiro Todoh
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Abstract
A method of integrating bone and implant material includes drilling a hole in either one of the bone and the implant material through to a junction of the bone and the implant material by applying a laser beam to either one of the bone and the implant material and integrating the bone and the implant material by applying a laser beam to the junction through the hole drilled at the drilling.
Claims8
A method of integrating bone and implant material, the method comprising:
- integrating the bone and the implant material by applying a laser beam to a junction of the bone and the implant material,
- wherein the integrating includes applying a laser beam to the junction such that the implant material is expanded by the application of the laser beam and expanded implant material fills a hole in the bone,
- melting the implant material by applying a laser beam to the implant material,
- foaming,
- wherein the foaming includes burning the bone by the application of the laser beam, and producing foamed air bubbles including bone component in melted implant material in a gas atmosphere obtained by burning the bone,
- and coagulating,
- wherein the coagulating includes forming a foamed layer on the implant material by stopping the application of the laser beam to the implant material such that the foamed air bubbles are confined and coagulated in the foamed layer.
4 more elements
Dependencies are inferred from the claim text.