Packaging for an electronic device
AssigneeAllegro Micosystems, LLC
InventorsShixi Louis Liu, Harianto Wong, Paul David, John B. Sauber, Shaun D. Milano, Raguvir Kanda, Bruce Hemenway
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Abstract
In one aspect, a method includes processing a metal substrate, performing a first etch on a first surface of the metal substrate to form, for an integrated circuit package, secondary leads and a curved component having two primary leads and performing a second etch, on a second surface of the substrate opposite the first surface, at locations on the secondary leads and locations on the curved component to provide a locking mechanism. Each primary lead located at a respective end of the curved component.
Claims12
An integrated circuit (IC) package comprising:
- a die;
- a housing to house the die;
- secondary leads, at least some of the secondary leads attached to the die, at least one of the secondary leads comprising a first recessed portion at a first end of the secondary lead and a first outside portion being substantially flat and extending away from the housing, the first outside portion comprising corners at a second end of the secondary lead, opposite the first end, configured to contribute to solder wicking;
- and
- a curved component attached to the die and having two primary leads substantially flat and extending away from the housing, each primary lead located at a respective end of the curved component, the curved component comprising a second recessed portion;
- wherein at least one of the first recessed portion or the second recessed portion forms a locking mechanism with the housing,
- wherein at least one surface of a secondary lead forms a bottom surface of the package, and
- wherein at least one surface of the curved component forms a bottom surface of the package.
A current sensor disposed in a package, comprising:
- a die comprising at least two magnetic field sensing elements;
- a housing to house the die;
- secondary leads, at least some of the secondary leads attached to the die, at least one of the secondary leads comprising a first outside portion being substantially flat and extending away from the housing, the first outside portion comprising corners configured to contribute to solder wicking;
- and
- a curved component at least partial wrapped around one of the at least two magnetic field sensing elements and attached to the die, the curved component having a first end and a second end and configured to receive current at one of the first end or the second end, the first end and the second end being substantially flat and extending away from the housing,
- wherein at least one surface of a secondary lead forms a bottom surface of the package, and
- wherein at least one surface of the curved component forms a bottom surface of the package.
Dependencies are inferred from the claim text.