Method for assembling a chip in a flexible substrate
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorJean Brun
Life of this patent
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Abstract
A substrate provided with an electrically conducting wire coated with an electrically insulating material is impregnated with a polymerizable material. A reception area for a chip is formed on a surface of the substrate by means of deformation. The housing area is stiffened using the polymerizable material. The chip is disposed in the reception area and an electrical connection area of the chip is connected electrically to the electrically conducting wire of the substrate.
Claims19
A method for assembling an electronic chip on a flexible substrate comprising the successive following steps:
- providing the flexible substrate provided with at least one electrically conducting wire and with a polymerizable material;
- making the polymerizable material react in a first area of the flexible substrate so as to stiffen this first area of the flexible substrate and not to react in a second area of the flexible substrate, the first area forming a housing area for the electronic chip on a surface of the flexible substrate, the housing area representing a more rigid area of the flexible substrate as compared to the second area;
- and
- arranging the electronic chip in the housing area and electrically connecting the at least one electrically conducting wire with an electric connection area of the chip.
A method for assembling an electronic chip on a flexible substrate comprising the following steps:
- providing the flexible substrate provided with at least one electrically conducting wire and with a polymerizable material;
- making the polymerizable material react in a first area of the flexible substrate so as to stiffen this first area of the flexible substrate and to form a housing area for the electronic chip on a surface of the flexible substrate;
- arranging the electronic chip in the housing area and electrically connecting the at least one electrically conducting wire with an electric connection area of the chip and with an additional electric connection area of the electronic chip;
- and
- cutting the at least one electrically conducting wire between the electric connection area of the electronic chip and the additional electric connection area of the electronic chip.
A method for assembling an electronic chip on a flexible substrate comprising the following steps:
- providing the flexible substrate provided with at least one electrically conducting wire and with a polymerizable material;
- making the polymerizable material react in a first area of the flexible substrate so as to stiffen this first area of the flexible substrate and not to react in a second area of the flexible substrate, the first area forming a housing area for the electronic chip on a surface of the flexible substrate, the housing area representing a more rigid area of the flexible substrate as compared to the second area;
- and
- pressing and securing the electronic chip against a counter-plate, the electronic chip being arranged in the housing area and electrically connecting the at least one electrically conducting wire with an electric connection area of the chip.
A method for assembling an electronic chip on a flexible substrate comprising the following steps:
- providing the flexible substrate provided with at least one electrically conducting wire and with a polymerizable material;
- deforming a portion of the flexible substrate comprising the polymerizable material;
- making the polymerizable material react in a first area of the deformed portion of the flexible substrate so as to stiffen this first area of the flexible substrate and to form a housing area for the electronic chip on a surface of the flexible substrate;
- and
- arranging the electronic chip in the housing area and electrically connecting the at least one electrically conducting wire with an electric connection area of the chip.
Dependencies are inferred from the claim text.