Electronic device

An electronic device comprising:

• a housing comprising a first surface and a second surface opposite to the first surface, wherein a concave portion is formed in the first surface of the housing;
• a lid made of a semiconductor material containing an impurity material and comprising a first surface and a second surface opposite to the first surface, wherein the first surface of the lid faces the first surface of the housing;
• a first metal film formed in a metal film formation region on the first surface of the housing, wherein the metal film formation region is defined as a region surrounding the concave portion on the first surface of the housing;
• a second metal film formed on the first surface of the lid to overlap with the metal film formation region in a plan view of the electronic device, the second metal film having a rectangular annular shape in the plan view;
• a third metal film formed on the second surface of the lid to overlap with the metal film formation region in the plan view;
• and
• an electronic component disposed in the concave portion,
• wherein the lid is bonded onto the housing via the first and second metal films to cover the electronic component disposed in the concave portion,
• wherein the third metal film comprises a plurality of metal film portions which are arranged to be separated from each other in the plan view.