Method for producing printed-wiring board

A method for producing a printed-wiring board in a semi-additive process, comprising:

• providing a chemical copper plating on an insulation layer or forming a copper thin film as a seed layer on the insulation layer using a sputtering method;
• subjecting a surface of the chemical copper plating or a surface of the copper thin film to a roughening treatment using an etching solution containing 0.1 to 3% by mass of hydrogen peroxide, 0.3 to 5% by mass of sulfuric acid, 0.1 to 3 ppm of halogen ion and 0.003 to 0.3% by mass of tetrazoles;
• attaching a dry film resist to the surface of the chemical copper plating or the surface of the copper thin film after the roughening treatment to perform exposure and development and providing an electrolytic copper plating to an opening after the exposure;
• and
• subjecting the remaining dry film resist to a stripping treatment using a resist stripping liquid containing 0.5 to 20% by mass of monoethanolamine, 0.2 to 10% by mass of quaternary ammonium hydroxide, 0.01 to 10% by mass of ethylene glycols and 0.01 to 0.5% by mass of azoles,
• wherein a copper surface roughness (Ra) before and after the roughening treatment is 0.1 to 0.3 μm with the proviso that the value of the copper surface roughness is measured by using a scanning tunneling microscope (30,000×).