Packaging substrate having embedded passive component and fabrication method thereof

A packaging substrate having at least an embedded passive component, comprising:

• a core board having at least a cavity;
• a single-material dielectric layer unit having an upper surface and a lower surface, and encapsulating the core board and filling the cavity of the core board;
• a plurality of positioning pads embedded in the lower surface of the dielectric layer unit;
• at least a passive component having upper and lower surfaces each having a plurality of electrode pads disposed thereon, the passive component being embedded in the dielectric layer unit so as to be received in the cavity of the core board at a position corresponding to the positioning pads;
• a first wiring layer disposed on the upper surface of the dielectric layer unit and electrically connected to the electrode pads of the upper surface of the passive component through a plurality of first conductive vias;
• and
• a second wiring layer disposed on the lower surface of the dielectric layer unit and electrically connected to the electrode pads of the lower surface of the passive component through a plurality of second conductive vias,
• wherein the second conductive vias penetrate the positioning pads, respectively, and
• the dielectric layer unit encapsulates the positioning pads and the passive component.