Loading patent…
AssigneeCorning Cable Systems LLC
InventorsThomas Edmond Flaherty, IV, Gary Richard Trott, Jeevan Kumar Vemagiri
Estimating the term…
Controlled-impedance out-of-substrate package structures employing electrical devices and related assemblies, components, and methods are disclosed. An out-of-substrate package structure may be used to electrically couple an electrical device to an electrical substrate, for example a printed circuit board. The out-of-substrate package structure may be electrically coupled to the electrical substrate. Ground paths of the out-of-substrate package structure may be arranged proximate to the electrical device and arranged symmetric with respect to at least one geometric plane intersecting the electrical device. In this regard, electric field lines generated by current flowing into the electrical device tend to terminate at the return or ground paths allowing for impedance to be more easily controlled. Accordingly, the out-of-substrate package structure may be impedance matched in a better way with respect to power provided from the electrical substrate enabling faster electrical device speeds.
A controlled-impedance out-of-substrate package structure mountable on an electrical substrate, comprising:
An electrical system, including a controlled-impedance out-of-substrate package structure mounted on an electrical substrate, the out-of-substrate package structure comprising:
A method of mounting an out-of-plane package structure on an electrical substrate to control impedance, comprising:
An electrical system, including a controlled-impedance out-of-plane package structure mounted on an electrical substrate, comprising:
Dependencies are inferred from the claim text.