Gold finger and touch screen

A touch screen, comprising a sensing component, a circuit board and an anisotropic conductive adhesive comprising a plurality of conductive spheres, and a gold finger disposed on the sensing component, wherein the gold finger comprises a substrate, an embossable adhesive layer and a plurality of wires which are electrically connected with the circuit board through the conductive spheres of the anisotropic conductive adhesive, the embossable adhesive layer is adhered to a side of the substrate, grid-shaped grooves are provided on a side of the embossable adhesive layer away from the substrate, the wires comprise conductive grids embedded in the grooves;

• wherein the conductive grids of the wires are formed by curing a conductive material filled in the grooves, the conductive material is metal, graphene, conductive macromolecule, carbon nanotube or indium tin oxide;
• wherein the wires can be electrically connected with the circuit board through an anisotropic conductive adhesive which comprises a plurality of conductive spheres, a diameter of a maximum circle in an area surrounded by a grid unit is less than an average of distances between each two adjacent conductive spheres.

A touch screen, comprising a sensing component, a circuit board and an anisotropic conductive adhesive comprising a plurality of conductive spheres, and a gold finger disposed on the sensing component, wherein the gold finger comprises a substrate, an embossable adhesive layer and a plurality of wires which are electrically connected with the circuit board through the conductive spheres of the anisotropic conductive adhesive, the embossable adhesive layer is adhered to a side of the substrate, grid-shaped grooves are provided on a side of the embossable adhesive layer away from the substrate, the wires comprise conductive grids embedded in the grooves;

• wherein a diameter of the conductive sphere is equal to or larger than a diameter of a maximum circle of an area surrounded by a grid unit of the wires, and is equal to or less than 1.2 times of the diameter of the maximum circle of the area surrounded by the grid unit of the wires.