Blind via printed circuit board fabrication supporting press fit connectors
AssigneeDell Products L.P.
InventorsKevin W. Mundt, Jason D. Adrian
Life of this patent
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Abstract
An information handling system circuit board interfaces storage device surface connectors and storage device controllers disposed on opposing sides by coupling a first circuit board portion having a controller press in connector to a second circuit board portion having plural surface connectors. The first and second circuit board portions couple to each other with an adhesive activated by curing. Resistant ink is printed over openings of the first circuit board portion where adhesive is applied in order to prevent the adhesive from flowing into the openings at or before the curing of the adhesive.
Claims9
A method for fabrication of a circuit board, the method comprising:
- forming blind vias at an upper surface of a first circuit board portion;
- drilling openings through the blind vias and lower surface of the first circuit board portion;
- flowing plating fluids through the blind vias and openings to plate the blind vias;
- disposing ink over the lower surface of the first circuit board portions to cover the openings;
- coupling a second circuit board portion at the lower surface of the first circuit board portion;
- and
- drilling vias through the first and second circuit board portions to support an interface between the first and second portions.
Dependencies are inferred from the claim text.