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US 9,179,543 B2Granted
Flexible LED device with wire bond free die
Assignee3M Innovative Properties Company
InventorsRavi Palaniswamy, Arokiaraj Jesudoss, Alejandro Aldrin Il Agcaoili Narag, Siang Sin Foo, Fong Liang Tan, Andrew J. Ouderkirk, Justine A. Mooney
Life of this patent
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Abstract
An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.
Claims5
An article comprising:
- a flexible polymeric dielectric layer having a first major surface and an opposing second major surface, the first and second major surfaces each having a conductive layer thereon, the dielectric layer having at least one via extending from the first major surface to the second major surface, the at least one via containing a conductive material electrically connected to the conductive layer on the second major surface and including electrically separated first and second portions, the first and second portions having respective first and second top surfaces facing the first major surface and opposing first and second bottom surfaces facing the second major surface, the first and second top surfaces configured to support and electrically connect a light emitting semiconductor device to the conductive layer on the first major surface.
Dependencies are inferred from the claim text.