Wiring board and design method for wiring board

A wiring board comprising:

• a plurality of wiring lines formed on a substrate;
• a plurality of lands that are formed at each connection portion of the plurality of wiring lines and structured respectively with a wiring pattern of a single wiring line having substantially identical shape;
• a plurality of pad electrodes that are formed on each of the plurality of lands through an insulating film having substantially identical shape;
• and
• a plurality of interlayer connection vias embedded in the insulating film and electrically connecting a portion of each of the plurality of lands to each of the plurality of pad electrodes,
• wherein the interlayer connection vias are arranged such that, from among the plurality of wiring lines, the longer the wiring length of the wiring lines is, the shorter the wiring length of the wiring pattern between the connection portion of the wiring lines and the portion at where the interlayer connection vias is formed is.

A design method for a wiring board including a plurality of wiring lines formed on a substrate, a plurality of lands formed at each connection portion of the plurality of wiring lines and respectively structured with a wiring pattern of a single wiring line having substantially identical shape, a plurality of pad electrodes having substantially identical shape formed on each of the plurality of lands through an insulating film, and a plurality of interlayer connection vias embedded in the insulating film and electrically connecting a portion of each of the plurality of lands to the plurality of pad electrodes, the design method comprising:

• determining positions of the plurality of pad electrodes;
• arranging respectively the plurality of wiring lines connecting between the pad electrodes such that a wiring length of the wiring lines between connection terminal portions of the wiring lines is minimized;
• extracting a group of wiring lines required to an equal length processing of the wiring lines from among the arranged plurality of wiring lines;
• calculating a wiring length of a wiring line belonging to the group;
• and
• arranging the interlayer connection vias, based on the calculated wiring length of the wiring line, such that the longer the wiring length of the wiring line is, the shorter the wiring length of the wiring pattern between the connection portion of the wiring lines and the portion at where the interlayer connection via is formed is.