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US 9,179,221 B2Granted
MEMS devices, interface circuits, and methods of making thereof
AssigneeInfineon Technologies AG
InventorsStefan Barzen, Andreas Wiesbauer, Christian Jenkner, Marc Fueldner
Life of this patent
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Abstract
A micro-electro-mechanical system (MEMS) device includes a first plate, a second plate disposed over the first plate, and a first moveable plate disposed between the first plate and the second plate. The MEMS device further includes a second moveable plate disposed between the first moveable plate and the second plate.
Claims25
A micro-electro-mechanical system (MEMS) device comprising:
- a first plate;
- a second plate disposed over the first plate;
- a first moveable plate disposed between the first plate and the second plate;
- and
- a second moveable plate disposed between the first moveable plate and the second plate, wherein the MEMS device comprises a first input/output node coupled to the first plate, a second input/output node coupled to the second plate, a third input/output node coupled to the first moveable plate, and a fourth input/output node coupled to the second moveable plate, wherein the first input/output node is a different input/output node from the second input/output node, and wherein the third input/output node is a different input/output node from the fourth input/output node, wherein the first moveable plate is rigidly coupled to the second moveable plate, and wherein the first moveable plate is configured to be shielded from capacitive coupling with the second moveable plate.
2 more elements
A sensor circuit comprising:
- a micro-electro-mechanical system (MEMS) structure forming a four terminal capacitive sensor, the MEMS structure comprising a first plate of a first type, a second plate of the first type, a first plate of a second type, and a second plate of the second type;
- a first filter circuit coupled between a voltage source and a first input bias node configured to be coupled to the first plate of a first type of the four terminal capacitive sensor;
- and
- a second filter circuit coupled between the voltage source and a second input bias node configured to be coupled to the second plate of the first type of the capacitive sensor, wherein the second filter circuit is a different circuit from the first filter circuit, wherein the capacitive sensor comprises the first plate of the first type capacitively coupled to the first plate of the second type and the second plate of the first type capacitively coupled to the second plate of the second type, wherein the first plate of the first type is rigidly coupled to the second plate of the first type, and wherein the first plate of the first type is configured to be shielded from capacitive coupling with the second plate of the first type.
1 more element
A method of forming a micro-electro-mechanical system (MEMS) device, the method comprising:
- forming a first plate in or over a substrate;
- forming a second plate over the first plate;
- forming a first moveable plate between the first plate and the second plate;
- and
- forming a second moveable plate between the first moveable plate and the second plate, wherein the MEMS device comprises a first input/output node coupled to the first plate, a second input/output node coupled to the second plate, a third input/output node coupled to the first moveable plate, and a fourth input/output node coupled to the second moveable plate, wherein the first input/output node is a different input/output node from the second input/output node, and wherein the third input/output node is a different input/output node from the fourth input/output node, wherein the first moveable plate is rigidly coupled to the second moveable plate, and wherein the first moveable plate is configured to be shielded from capacitive coupling with the second moveable plate.
2 more elements
Dependencies are inferred from the claim text.