Solid-state imaging apparatus and method of producing a solid-state imaging apparatus
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsTakao Takeshita, Hiroo Uchiyama
Life of this patent
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Abstract
A solid-state imaging apparatus in which heat dissipation and electromagnetic shielding can be efficiently performed is provided. The solid-state imaging apparatus includes: an MCM board 41 on which a sensor 42, and a SiP 44 that processes an output signal from the sensor 42 are mounted; a power supply board 61 on which a power supply IC 62 is mounted; and a shielding section 50 which is placed between the MCM board 41 and the power supply board 61 to cover the power supply IC 62, and which has an electrically conductive property and a thermally conductive property.
Claims13
A solid-state imaging apparatus including:
- a first board on which a solid-state imaging element, and a signal processing circuit that processes an output signal from the solid-state imaging element are mounted;
- a second board on which a power supplying circuit is mounted, the power supplying circuit being configured to supply electric power to the signal processing circuit;
- an electromagnetic shielding and heat dissipation plate which is placed between the first board and the second board to cover the power supplying circuit, and which has an electrically conductive property and a thermally conductive property;
- and
- a case which houses the first board and the second board, wherein:
- the electromagnetic shielding and heat dissipation plate covers a side surface of the second board,
- the electromagnetic shielding and heat dissipation plate is thermally in contact with the signal processing circuit mounted on the first board or the power supplying circuit mounted on the second board, and
- the electromagnetic shielding and heat dissipation plate is thermally in contact with the case.
Dependencies are inferred from the claim text.