Preassembled optoelectronic interconnect structure

A system comprising:

• a plurality of integrated circuit chips arranged in a stack;
• a plurality of vertical electrical interconnects electrically connecting together the plurality of integrated circuit chips arranged in the stack, the plurality of vertical electrical interconnects extending, at least in part, through the plurality of integrated circuit chips in the stack;
• another interconnect component, the another interconnect component comprising;
• a preassembled optoelectronic interconnect structure electrically connected between a first integrated circuit chip and a second integrated circuit chip of the plurality of integrated circuit chips arranged in the stack, the preassembled optoelectronic interconnect structure comprising:
• an optical waveguide link, the optical waveguide link having a first end and a second end, and extending, at least in part, vertically along an edge of the stack between the first integrated circuit chip and the second integrated circuit chip of the stack;
• a first optoelectronic circuit attached to the first end of the optical waveguide link, and a second optoelectronic circuit attached to the second end of the optical waveguide link, the first and second optoelectronic circuits comprising active optical componentry facilitating, in part, optical signal communication across the optical waveguide link;
• a first plurality of electrical contacts associated with the first optoelectronic circuit and a second plurality of electrical contacts associated with the second optoelectronic circuit, the first and second pluralities of electrical contacts electrically operatively connecting the preassembled optoelectronic interconnect structure to the first and second integrated, chips, respectively, in the stack;
• and
• wherein the another interconnect component provides addition interconnect to the stack along the edge of the stack to that provided by the plurality of vertical electrical interconnects extending through the stack.