US 9,178,491 B2 · Circuit module including duplexer

Abstract

A circuit module includes a duplexer mounted on a module board and a cover layer is stacked on an insulating layer that is disposed on one principal surface of a device board so as to enclose a predetermined area thereof. A transmission filter device and a reception filter device that have different transmission bands are provided on the one principal surface of the device board in the predetermined area thereof within the space enclosed by the insulating layer between the device board and the cover layer. Accordingly, the duplexer does not include a package board as in the existing technique, and in turn a circuit module including the duplexer mounted on the module board is significantly reduced in height and in size.

Drawings

Drawings are temporarily unavailable. Open the PDF at USPTO

Drawings

Claims20

Dependent claims

A circuit module, comprising:

a device board;
an insulating layer arranged on one principal surface of the device board so as to enclose a predetermined area thereof;
a cover layer stacked on the insulating layer so as to provide a space enclosed by the insulating layer between the cover layer and the device board;
a duplexer including a first filter device and a second filter device, the first and second filter devices having different transmission bands, and the first and second filter devices being provided in the predetermined area within the space;
a module board, on which the duplexer is mounted;
a first circuit element provided in the cover layer, the first circuit element being connected to the first filter device or the second filter device;
a second circuit element provided in or on the module board, the second circuit element being connected to the first filter device or the second filter device;
and
the cover layer includes a plurality of a resin layers stacked on each other, and an electrode pattern defining the first circuit element provided on each of the plurality of the resin layers.

6 more elements

Dependencies are inferred from the claim text.

Description6,882 words

Summary1,653 words

#1. Field of the Invention

#The present invention relates to circuit modules that include duplexers including a first filter device and a second filter device that have different transmission bands.

#2. Description of the Related Art

Brief description of the drawings6 figures

#FIG. 1 is a diagram illustrating a first preferred embodiment of a circuit module of the present invention.

#FIG. 2 is a block diagram illustrating an internal configuration of the circuit module illustrated in FIG. 1.

#FIG. 3 is a diagram illustrating a second preferred embodiment of a circuit module of the present invention.

Detailed description5,126 words

#First Preferred Embodiment

#A first preferred embodiment of a circuit module that includes a duplexer of the present invention will be described with reference to FIG. 1 and FIG. 2. FIG. 1 is a diagram illustrating the first preferred embodiment of the circuit module that includes the duplexer of the present invention. FIG. 2 is a block diagram illustrating the internal configuration of the circuit module illustrated in FIG. 1. FIG. 1 and FIG. 2 illustrate only principal configurations pertaining to the first preferred embodiment of the present invention, and other configurations are omitted therein. In addition, FIG. 3 to FIG. 5 illustrating second to fourth preferred embodiments, which will be described later, illustrate only principal configurations, similarly to FIG. 1, and thus description thereof will be omitted below.

#A circuit module 1 illustrated in FIG. 1 and FIG. 2 is mounted on a motherboard included in a portable communication terminal such as a cellular phone and a portable information terminal, for example. In the first preferred embodiment, the circuit module 1 includes a duplexer 10 that includes a transmission filter device 14 and a reception filter device 15, a module board 2, a matching circuit 3, a shield electrode 4, and various other components (not illustrated) such as a switch IC, a filter, a resistor, a capacitor, and a coil, and is preferably included in a high frequency antenna switch module.

Facts

Application

14/146,740Filed 3 Jan 2014 · continuation

Priority

JP 2011-1521628 Jul 2011

Published

US 2014/0118084 A11 May 2014

Granted

3 Nov 2015

Term ends

8 Jul 2032

Estimated · how

20 years from earliest known nonprovisional domestic filing plus recorded patent term adjustment, including 2 days of adjustment. Maintenance-fee lapses, terminal disclaimers and statutory extensions have not been checked. The continuity chain may be incomplete; this is not an enforceability determination.

Classification5 codes

H03H 9/706
Networks using bulk acoustic wave devices: duplexers
H03H 9/0576
For duplexers: including surface acoustic wave [SAW] devices
H03H 9/1092
For surface acoustic wave [SAW] devices: the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic…
H03H 9/725
Networks using surface acoustic waves: duplexers

Timeline

8 Jul 2011Priority claimedJP 2011-152162
3 Jan 2014Application filedUS 14/146,740
6 Jan 2014Assigned to Murata Manufacturing Co., Ltd.assignment of assignor's interest
1 May 2014PublishedUS 2014/0118084 A1
3 Nov 2015GrantedUS 9,178,491 B2
12 Oct 2026TodayWithin its term
8 Jul 2032Term endsEstimated, includes 2 days of adjustment

Circuit module including duplexer

Life of this patent

Circuit module including duplexer

Life of this patent

Life of this patent

Abstract

Drawings

Drawings

Claims20

Description6,882 words

Drawings

Classification5 codes

Life of this patent

Description6,882 words