Multilayer chip electronic component and board having the same

A board having a multilayer chip electronic component, comprising:

• a printed circuit board having first to third electrode pads disposed thereon;
• and
• the multilayer chip electronic component mounted on the printed circuit board,
• wherein the multilayer chip electronic component includes:
• a ceramic body including a plurality of dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other, an inductor part disposed within the ceramic body and including first and second internal electrodes, the first internal electrode being exposed to the first side surface and the first end surface, and the second internal electrode being exposed to the first side surface and the second end surface, a capacitor part disposed within the ceramic body and including third to fifth internal electrodes, the third internal electrode being exposed to the first and second side surfaces, the fourth internal electrode being exposed to the first end surface, and the fifth internal electrode being exposed to the second end surface, and first and second external electrodes respectively disposed on the first and second end surfaces of the ceramic body and electrically connected to the first and second internal electrodes and the fourth and fifth internal electrodes, a third external electrode extended from the second main surface of the ceramic body to the first and second side surfaces and connected to the third internal electrode, and a fourth external electrode extended from the first main surface of the ceramic body to the first and second side surfaces and connected to the first and second internal electrodes, the capacitor part being composed of first and second capacitor parts and the inductor part and the capacitor part being connected to each other.