Wireless apparatus

#This application is based upon and claims the benefit of priority from prior Japanese Patent Application No. 2011-155138, filed Jul. 13, 2011, the entire contents of which are incorporated herein by reference.

#Embodiments described herein relate generally to a wireless apparatus.

#There is a technique of forming an antenna element by solder balls on a ball grid array package as a semiconductor package with build-in antenna. In this technique, the volume (scale) of a wireless apparatus can be made small as compared with a case in which an external antenna is added. Furthermore, additional steps are not required for a manufacturing process, thereby reducing the manufacturing cost of the wireless apparatus.

#FIG. 1A is a perspective view illustrating a wireless apparatus according to the first embodiment;

#FIG. 1B is a sectional view illustrating the wireless apparatus according to the first embodiment;

#FIG. 2A is a perspective view illustrating a wireless apparatus according to the first modification of the first embodiment;

#Using solder balls for an antenna decreases the number of pins of a package usable for a connection between a wireless chip and a board, thereby lowering the degree of freedom of wiring. For example, it is necessary to decrease the number of pins used for grounding in order to decrease the number of pins except for pins for the antenna. To the contrary, increasing the number of pins of the package to obtain a sufficient number of pins increases the size of the package or decreases the intervals between the pins, thereby lowering the degree of freedom of wiring.

#In general, according to one embodiment, a wireless apparatus includes an antenna, a semiconductor chip and a board. The antenna comprises a radiating element comprising a main radiating part, and the main radiating part is a portion with highest radiation intensity at an operating frequency. The semiconductor chip is connected with the antenna. The board has a first surface and a second surface, a plurality of terminals are arranged on the first surface, and the semiconductor chip is arranged on the second surface. The main radiating part is arranged outside a first region and a second region, the first region is a region defined by imaginary lines passing through centers of peripheral terminals among the terminals, and the second region is defined as a region where the first region is orthogonally projected onto the second surface.

#A wireless apparatus according to the present embodiments will be described in detail below with reference to the accompanying drawings. Note that in the following embodiments, parts with the same reference numerals perform the same operation, and a repetitive description thereof will be omitted.