Method of manufacturing light emitting device package having reflector and phosphor layer

A method of manufacturing a light emitting device (LED) package, the method comprising:

• mounting an LED chip on a substrate;
• coating an insulating layer on the substrate;
• pressing the insulating layer with a first stamp having a patterned surface;
• etching the pressed insulating layer to expose a portion of the LED chip;
• depositing a metallic layer that connects the exposed LED chip and the substrate;
• forming an electrode by removing the insulating layer;
• spraying, on the substrate, a reflector material;
• pressing the sprayed reflector material with a second stamp having a patterned surface, using nano imprinting;
• forming a reflector to have a pattern corresponding to the patterned surface of the second stamp by etching the pressed reflector material to expose the LED chip;
• and
• forming a phosphor layer on the LED chip.