Absorbers for high efficiency thin-film PV
AssigneeIntermolecular, Inc.
InventorsHaifan Liang, Jeroen Van Duren
Life of this patent
Estimating the term…
Abstract
Methods are described for forming CIGS absorber layers in TFPV devices with graded compositions and graded band gaps. Methods are described for utilizing Al to increase the band gap at the front surface of the absorber layer. Methods are described for forming a Cu—In—Ga layer followed by partial or full selenization. This results in a higher Ga concentration at the back interface. The substrate is then exposed to an aluminum CVD precursor while the substrate is still in the selenization equipment to deposit a thin Al layer. The substrate is then exposed to a Se source to fully convert the absorber layer. This results in a higher Al concentration at the front of the absorber.
Claims6
A semiconductor material comprising:
- a layer formed above a surface of a substrate, wherein the layer comprises Cu, In, Ga, Ag, and Se,
- wherein the layer further comprises at least one of Mg, K, or Ca,
- wherein a composition of Ga varies in concentration between a back surface of the layer and a front surface of the layer, and
- wherein a composition of Ag varies in concentration between a back surface of the layer and a front surface of the layer.
Dependencies are inferred from the claim text.