Systems and methods for fabricating semiconductor devices at different levels
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChi-Wen Liu, Chao-Hsiung Wang
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Abstract
Systems and methods are provided for fabricating semiconductor device structures on a substrate. For example, a substrate including a first region and a second region is provided. One or more first semiconductor device structures are formed on the first region. One or more semiconductor fins are formed on the second region. One or more second semiconductor device structures are formed on the semiconductor fins. A top surface of the semiconductor fins is higher than a top surface of the first semiconductor device structures.
Claims10
A method for fabricating semiconductor device structures on a substrate, the method comprising:
- providing a substrate including a first region and a second region;
- forming one or more first semiconductor device structures on the first region;
- growing one or more semiconductor fins in the second region;
- and
- forming one or more second semiconductor device structures on the semiconductor fins, wherein a top surface of the semiconductor fins is higher than a top surface of the first semiconductor device structures.
Dependencies are inferred from the claim text.