US 9,177,957 B1Granted

Embedded packaging device

AssigneeDelta Electronics, Inc.

InventorsPeng Hsin Lee, Hsin Chang Tsai, Chia Yen Lee

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Abstract

An embedded packaging device is provided, including a leadframe, a first semiconductor component, a second semiconductor component, a passive component, and a first dielectric layer. The leadframe forms a counterbore. The first semiconductor component is disposed on the leadframe. The second semiconductor component is disposed on the leadframe and electrically connected with the first semiconductor component through the leadframe. The passive component is disposed on the leadframe and has a different thickness from the first semiconductor component, wherein the passive component or the first semiconductor component is disposed in the counterbore of the leadframe, such that a top surface of the passive component has the same height as that of the first semiconductor component. The first dielectric layer is formed on the leadframe and covers the first semiconductor component, the second semiconductor component, and the passive component.

Claims19

Dependent claims

An embedded packaging device, comprising:

a leadframe;
a first semiconductor component, disposed on the leadframe;
a second semiconductor component, disposed on the leadframe, and electrically connected with the first semiconductor component;
a passive component, disposed on the leadframe, and electrically connected with the first semiconductor component and the second semiconductor component;
a first dielectric layer, formed on the leadframe, and covering the first semiconductor component, the second semiconductor component, and the passive component;
a plurality of first conductive vias, formed in the first dielectric layer;
and a first conductive film, formed on the first dielectric layer, and electrically leadframe through the plurality of first conductive vias;
wherein at least one of the first semiconductor component and the second semiconductor component is flip-chip mounted on the leadframe;
wherein the first semiconductor component is a High-Voltage (HV) switch having a first source pad, a first drain pad, and a first gate pad, and wherein the second semiconductor component is a Low-Voltage (LV) switch having a second source pad, a second drain pad, and a second gate pad.

6 more elements

An embedded packaging device, comprising:

a leadframe, including a first part, a second part, a third part, and a fourth part;
an HV switch, disposed on the leadframe, and having a first drain pad electrically connected with the first part of the leadframe, a first gate pad electrically connected with the second part of the leadframe, and a first source pad electrically connected with the third part of the leadframe;
an LV switch, disposed on the leadframe, and having a second drain pad electrically connected with the third part of the leadframe, a second gate pad electrically connected with the fourth part of the leadframe, and a second source pad electrically connected with the second part of the leadframe;
a passive component, disposed on the leadframe, and having a first terminal electrically connected with the second part of the leadframe and a second terminal electrically connected with the third part of the leadframe;
a first dielectric layer, formed on the leadframe, and covering the HV switch, the LV switch, and the passive component;
a plurality of first conductive vias, formed in the first dielectric layer, and
a first conductive film, formed on the first dielectric layer, and electrically connected with the LV switch and the leadframe through the plurality of first conductive vias.

4 more elements

Dependencies are inferred from the claim text.