US 9,177,942 B2 · Semiconductor package and method of fabricating the same

Abstract

Provided are semiconductor packages and methods of fabricating the same. The method may include mounting a first semiconductor chip including chip and heat-transfer regions and a lower heat-transfer pattern disposed on the heat-transfer region, on a substrate, mounting a second semiconductor chip on the chip region of the first semiconductor chip, forming a mold layer on the substrate to enclose the first and second semiconductor chips, forming an opening in the mold layer to expose at least a portion of the lower heat-transfer pattern, forming a heat-pathway pattern in the opening, and forming a heat-dissipating part on the second semiconductor chip and the mold layer to be connected to the heat-pathway pattern.

Claims13

Dependent claims

A semiconductor package, comprising:

a first semiconductor chip mounted on a substrate, the first semiconductor chip having a top surface including a chip region and a heat-transfer region;
a second semiconductor chip mounted on the chip region of the first semiconductor chip;
a lower heat-transfer pattern disposed on the heat-transfer region of the first semiconductor chip;
a mold layer encapsulating the first semiconductor chip and the second semiconductor chip;
a heat-pathway pattern extending through the mold layer and connected to the lower heat-transfer pattern;
and
a heat-dissipating part disposed on the second semiconductor chip and the mold layer and connected to the heat-pathway pattern,
wherein the mold layer covers portions of the lower heat transfer pattern and the heat-pathway pattern.

5 more elements

Dependencies are inferred from the claim text.

Semiconductor package and method of fabricating the same

Life of this patent

Semiconductor package and method of fabricating the same

Life of this patent

Abstract

Claims13