Leadless surface mount assembly package and method of manufacturing the same

A method for forming a surface mount assembly package, comprising:

• providing an array of a plurality of first leads, a plurality of second leads, and a plurality of third leads;
• fixing a plurality of chips to corresponding first leads, respectively;
• coupling a plurality of clips to corresponding second leads, respectively;
• coupling the plurality of chips to corresponding third leads, respectively;
• fixing lower surfaces of the clips on upper surfaces of corresponding chips that are fixed to the first leads;
• molding the plurality of first leads, the plurality of second leads, the plurality of third leads, the chip, and the clip using a molding compound to form a package array;
• and
• cutting the package array to form a plurality of individual packages, in which ends of first leads, second leads, and third leads on the side walls of each formed package are only exposed from the molding compound without outward extending from the molding compound, the ends of the third leads being exposed from a side of the molding compound different from which the first lead and the second lead are exposed.

A method for forming a surface mount assembly package, the method comprising:

• providing a first lead, a second lead, and a third lead;
• providing a chip;
• fixing the chip on the first lead;
• electrically coupling the chip to the third lead;
• providing a clip;
• coupling the clip and the second lead, and fixing a lower surface of the clip on an upper surface of the chip;
• molding the first lead, the second lead, the third lead, the chip and the clip using a molding compound, thereby forming the package, wherein end walls of the first lead, the second lead, and the third lead are only exposed from the molding compound without outward extending from a sidewall of the molding compound.