Semiconductor device connected by anisotropic conductive film having a reliability adhesive strength
AssigneeCheil Industries Inc.
InventorsYoun Jo Ko, Hye Su Ki, Ie Ju Kim
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Abstract
A semiconductor device connected by an anisotropic conductive film, the anisotropic conductive film including a binder resin; a first radical polymerization material having one or two (meth)acrylate reactive groups in a structure thereof and a second radical polymerization material having at least three (meth)acrylate reactive groups in a structure thereof; and conductive particles, the anisotropic conductive film having a moisture permeability of 170 g/m2/24 hr or less and a moisture absorbency of 2% or less.
Claims13
A semiconductor device connected by an anisotropic conductive film, the anisotropic conductive film comprising:
- a binder resin;
- a first radical polymerization material having one or two (meth)acrylate reactive groups in a structure thereof and a second radical polymerization material having at least three (meth)acrylate reactive groups in a structure thereof;
- and
- conductive particles,
- the anisotropic conductive film having a moisture permeability of 170 g/m2/24 hr or less and a moisture absorbency of 2% or less,
- wherein the anisotropic conductive film has a reliability connection resistance of 3Ω or less, as measured after being subjected to pre-compression under conditions of 60° C. to 80° C. at 1.0 MPa to 4.0 MPa for 1 second to 3 seconds and primary compression under conditions of 170° C. to 200° C. at 2.5 MPa to 7 MPa for 1 second to 7 seconds with a release film removed from the pre-compressed anisotropic conductive film, and being left at a temperature of 85° C. and a relative humidity of 85% for 500 hours.
A semiconductor device, comprising:
- a first connecting member including a first electrode;
- a second connecting member including a second electrode;
- and
- an anisotropic conductive film between the first connecting member and the second connecting member and bonding the first electrode to the second electrode, the anisotropic conductive film including:
- a binder resin;
- a first radical polymerization material having one or two (meth)acrylate reactive groups in a structure thereof and a second radical polymerization material having at least three (meth)acrylate reactive groups in a structure thereof;
- and
- conductive particles,
- the anisotropic conductive film having a moisture permeability of 170 g/m2/24 hr or less and a moisture absorbency of 2% or less,
- wherein the anisotropic conductive film has a reliability connection resistance of 3Ω or less, as measured after being subjected to pre-compression under conditions of 60° C. to 80° C. at 1.0 MPa to 4.0 MPa for 1 second to 3 seconds and primary compression under conditions of 170° C. to 200° C. at 2.5 MPa to 7 MPa for 1 second to 7 seconds with a release film removed from the pre-compressed anisotropic conductive film, and being left at a temperature of 85° C. and a relative humidity of 85% for 500 hours.
A semiconductor device connected by an anisotropic conductive film, the anisotropic conductive film comprising:
- a binder resin;
- a first radical polymerization material having one or two (meth)acrylate reactive groups in a structure thereof and a second radical polymerization material having at least three (meth)acrylate reactive groups in a structure thereof;
- and
- conductive particles,
- the anisotropic conductive film having a moisture permeability of 170 g/m2/24 hr or less and a moisture absorbency of 2% or less,
- wherein the anisotropic conductive film has a reliability bubbling area of 20% or less, as measured after being subjected to pre-compression under conditions of 60° C. to 80° C. at 1.0 MPa to 4.0 MPa for 1 second to 3 seconds and primary compression under conditions of 170° C. to 200° C. at 2.5 MPa to 7 MPa for 1 second to 7 seconds with a release film removed from the pre-compressed anisotropic conductive film, and being left at a temperature of 85° C. and a relative humidity of 85% for 500 hours.
Dependencies are inferred from the claim text.