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US 9,177,932 B1Granted
Semiconductor device having overlapped via apertures
AssigneeAmkor Technology, Inc.
InventorsJin Seong Kim, Dong Joo Park, Kwang Ho Kim, Hee Yeoul Yoo, Jeong Wung Jeong
Life of this patent
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Abstract
Disclosed is a semiconductor device having overlapped via apertures formed in an encapsulant to outwardly expose solder balls. When different types of semiconductor devices are electrically connected to the solder balls through the overlapped via apertures, flux or solder paste is unlikely to contact sidewall portions of the overlapped via apertures. Therefore, different types of semiconductor devices can be mounted with improved efficiency.
Claims20
An assembly comprising:
- a substrate comprising a first surface;
- a semiconductor die coupled to the first surface of the substrate;
- an encapsulant covering the first surface of the substrate and the semiconductor die, the encapsulant comprising:
- a first encapsulant surface facing the substrate;
- and
- a second encapsulant surface opposite the first encapsulant surface and separated from the first encapsulant surface by an encapsulant thickness;
- a plurality of solder balls coupled to the first surface of the substrate;
- and
- a plurality of overlapped via apertures in the encapsulant, each of which exposing a respective one of the solder balls,
- wherein the encapsulant comprises a central protrusion surrounded by the overlapped via apertures and having a protrusion thickness equal to the encapsulant thickness, the central protrusion comprising:
- at least four curved sides, each of which facing a respective one of the solder balls;
- and
- at least four vertices, each of which pointing between two adjacent ones of the solder balls.
10 more elements
An assembly comprising:
- a substrate comprising a first surface;
- a semiconductor die coupled to the first surface of the substrate;
- an encapsulant covering the first surface of the substrate and the semiconductor die, the encapsulant comprising:
- a first encapsulant surface facing the substrate;
- and
- a second encapsulant surface opposite the first encapsulant surface and separated from the first encapsulant surface by an encapsulant thickness;
- a plurality of solder balls coupled to the first surface of the substrate;
- and
- a plurality of overlapped via apertures in the encapsulant, each of which exposing a respective one of the plurality of solder balls,
- wherein the encapsulant comprises a central protrusion surrounded by the overlapped via apertures and having a protrusion thickness equal to the encapsulant thickness, the central protrusion comprising:
- at least four sides, each of which facing a respective one of the solder balls;
- and
- at least four vertices, each of which pointing between two adjacent ones of the solder balls.
10 more elements
An assembly comprising:
- a substrate comprising a first surface;
- a semiconductor die coupled to the first surface of the substrate;
- an encapsulant covering the first surface of the substrate and the semiconductor die, the encapsulant comprising:
- a first encapsulant surface facing the substrate;
- and
- a second encapsulant surface opposite the first encapsulant surface and separated from the first encapsulant surface by an encapsulant thickness;
- a plurality of solder balls coupled to the first surface of the substrate;
- and
- a plurality of overlapped via apertures in the encapsulant, each of which exposing a respective one of the plurality of solder balls,
- wherein the encapsulant comprises a central protrusion surrounded by the overlapped via apertures and having a protrusion thickness equal to the encapsulant thickness, the central protrusion comprising:
- at least four sides, each of which facing a respective one of the solder balls;
- and
- at least four vertices, each of which pointing between two adjacent ones of the solder balls,
- wherein each of the at least four sides is separated from its respective solder ball by a gap.
11 more elements
Dependencies are inferred from the claim text.