Apparatus related to an improved package including a semiconductor die
AssigneeFairfchild Semiconductor Corporation
InventorsAhmad R. Ashrafzadeh, Vijay G. Ullal, Justin Chiang, Daniel Kinzer, Michael M. Dube, Oseob Jeon, Chung-Lin Wu, Maria Cristina Estacio
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Abstract
In one general aspect, a method can include forming a redistribution layer on a substrate using a first electroplating process, and forming a conductive pillar on the redistribution layer using a second electroplating process. The method can include coupling a semiconductor die to the redistribution layer, and can include forming a molding layer encapsulating at least a portion of the redistribution layer and at least a portion of the conductive pillar.
Claims29
An apparatus, comprising:
- a first molding layer;
- a second molding layer;
- a substrate disposed between the first molding layer and the second molding layer;
- an inductive component disposed in the second molding layer;
- a capacitive component having at least a portion coupled to the substrate;
- a semiconductor die disposed in the first molding layer and including a semiconductor device, the semiconductor device being electrically coupled to the capacitive component;
- and
- a redistribution layer disposed in the first molding layer and coupled to the substrate;
- and
- a conductive pillar coupled to the redistribution layer such that the redistribution layer is disposed between the substrate and the conductive pillar.
An apparatus, comprising:
- a first redistribution layer disposed on a first side of a substrate, the first redistribution layer including a first redistribution layer portion and a second redistribution layer portion;
- a conductive pillar coupled to the first redistribution layer portion of the first redistribution layer;
- a semiconductor die including a semiconductor device coupled to the second redistribution layer portion of the first redistribution layer;
- a second redistribution layer disposed on a second side of the substrate, the second redistribution layer including a portion of an inductive component;
- a first molding layer encapsulating at least a portion of the semiconductor die on the first side of the substrate and encapsulating at a least a portion of the first redistribution layer;
- and
- a second molding layer disposed on the second side of the substrate.
An apparatus, comprising:
- a substrate;
- a first molding layer disposed on the substrate;
- a second molding layer;
- an inductive component disposed in the second molding layer;
- a first semiconductor die disposed within the first molding layer;
- a second semiconductor die disposed within the first molding layer, the second semiconductor die having a sidewall separated from a sidewall of the first semiconductor die by a first distance;
- a first conductor coupled to a surface of the first semiconductor die and aligned along a plane;
- and
- a second conductor coupled to a surface of the second semiconductor die and aligned along the plane, the first conductor being separated from the second conductor by a second distance greater than the first distance.
Dependencies are inferred from the claim text.