Chip package and method for forming the same
AssigneeXintec Inc.
InventorsChien-Hung Liu, Ying-Nan Wen
Life of this patent
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Abstract
A chip package including a first substrate having a first surface and a second surface opposite thereto is provided. The first substrate has a micro-electric element and a plurality of conducting pads adjacent to the first surface. The first substrate has a plurality of openings respectively exposing a portion of each conducting pad. A second substrate is disposed on the first surface. An encapsulation layer is disposed on the first surface and covers the second substrate. A redistribution layer is disposed on the second surface and extends into the openings to electrically connect the conducting pads.
Claims23
A chip package, comprising:
- a first substrate having a first surface and a second surface opposite thereto, wherein the first substrate has a micro-electric element and a plurality of conducting pads adjacent to the first surface, and wherein the first substrate has a plurality of openings respectively exposing a portion of each of the plurality of conducting pads;
- a second substrate disposed on the first surface;
- an encapsulation layer disposed on the first surface and covering the second substrate;
- and
- a redistribution layer disposed on the second surface and extending into the plurality of openings to electrically connect the plurality of conducting pads.
A method for forming a chip package, comprising:
- providing a first substrate having a first surface and a second surface opposite thereto, wherein the first substrate has a micro-electric element and a plurality of conducting pads adjacent to the first surface;
- disposing a second substrate on the first surface;
- forming an encapsulation layer on the first surface to cover the second substrate;
- forming a plurality of openings in the first substrate to respectively expose a portion of each of the plurality of conducting pads;
- and
- forming a redistribution layer on the second surface, wherein the redistribution layer extends into the plurality of openings to electrically connect the plurality of conducting pads.
Dependencies are inferred from the claim text.