Interconnect structures for integrated circuits and their formation

An interconnect structure for an integrated circuit device, comprising:

• first conductor coupled to circuitry;
• a second conductor;
• a first dielectric between the first and second conductors;
• a conductive overpass over and coupled to the first and second conductors and passing over the first dielectric;
• and
• a second dielectric that would electrically isolate the second conductor but for the second conductor coupling to the conductive overpass;
• wherein the second dielectric comprises portions that are contiguous with the first dielectric so that the second conductor is between the portions of the second dielectric;
• wherein the portions of the second dielectric that are contiguous with the first dielectric abut sides of the first dielectric;
• and
• wherein the first dielectric forms a loop around an end of the first conductor.

An interconnect structure for an integrated circuit device, comprising:

• a first conductor coupled to circuitry;
• a second conductor;
• a dielectric between the first and second conductors;
• and
• a conductive underpass under and coupled to the first and second conductors and passing under the dielectric, wherein the conductive underpass electrically couples the first conductor to the second conductor;
• wherein the second conductor would be floating but for its coupling to the conductive underpass;
• and
• wherein the conductive underpass is a single conductive plug that is in direct physical contact with both of the first and second conductors.

An interconnect structure for an integrated circuit device, comprising:

• a first conductor coupled to circuitry;
• a second conductor on a first side of the first conductor;
• a first dielectric on the first side of the first conductor between the first and second conductors;
• a third conductor on a second side of the first conductor;
• a second dielectric on the second side of the first conductor between the first and third conductors;
• and
• a contact extending over the first conductor, the first and second dielectrics, and portions of the second and third conductors so that the contact electrically couples the first conductor to the second conductor and electrically couples the first conductor to the third conductor;
• wherein the second and third conductors would be floating but for their contact with the contact;
• and
• wherein the contact is a single contact that is in direct contact with all of the first, second, and third conductors.

An interconnect structure for an integrated circuit device, comprising:

• a first conductive line coupled to circuitry;
• second and third conductive lines;
• a first dielectric between the first and second conductive lines;
• a second dielectric between the second and third conductive lines;
• a conductive plug under and coupled to the first and second conductive lines and passing under the first dielectric, wherein the conductive plug electrically couples the first conductive line to the second conductive line;
• and
• a conductive contact over and coupled to the second and third conductive lines and passing over the second dielectric, wherein the conductive contact electrically couples the second conductive line to the third conductive line;
• wherein the second conductive line would be floating but for its coupling to the conductive contact and the conductive plug and third conductive line would be floating but for its coupling to the conductive contact
• wherein the conductive plug is a single conductive plug that is in direct physical contact with both of the first and second conductive lines;
• and
• wherein the conductive contact is a single conductive contact that is in direct physical contact with both of the second and third conductive lines.

An interconnect structure for an integrated circuit device, comprising:

• a first conductive line coupled to circuitry;
• second and third conductive lines;
• a first dielectric between the first and second conductive lines;
• a second dielectric between the second and third conductive lines;
• a conductive plug under and coupled to the first and second conductive lines and passing under the first dielectric;
• and
• a conductive contact over and coupled to the second and third conductive lines and passing over the second dielectric;
• a third dielectric that would electrically isolate the second and third conductive lines but for their coupling to the conductive plug and the conductive contact;
• wherein the second conductive line would be floating but for its coupling to the conductive contact and the conductive plug and third conductive line would be floating but for its coupling to the conductive contact;
• wherein the third dielectric comprises first and second portions that are contiguous with the first dielectric;
• wherein the second and third conductive lines are between the first and second portions of the third dielectric;
• and
• wherein the second and third conductive lines are respectively portions of fourth and fifth conductive lines, wherein the first and second portions of the third dielectric electrically isolate the second and third conductive lines from other portions of the fourth and fifth conductive lines that are coupled to the circuitry.