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US 9,177,907 B1Granted
High performance deposited die attach
AssigneeRockwell Collins, Inc.
InventorsNathan P. Lower, Ross K. Wilcoxon, Nathaniel P. Wyckoff
Life of this patent
Estimating the term…
Abstract
A method of manufacturing an integrated circuit device includes providing a substrate; forming at least one cavity in the substrate; positioning a die within the at least one cavity of the substrate; and depositing a die attach material around the die within the at least one cavity to mechanically bond the die to the substrate.
Claims17
A method of manufacturing an integrated circuit device comprising:
- providing a substrate having a first surface and a second surface opposite the first surface;
- forming at least one cavity in the substrate, the cavity extending through the substrate from the first surface to the second surface;
- applying a removable film to the first surface of the substrate;
- positioning at least one die within the at least one cavity of the substrate such that an active surface of the die physically contacts and faces the removable film;
- depositing a die attach material around the at least one die within the at least one cavity to mechanically bond the at least one die to the substrate;
- and
- planarizing the die attach material and the second surface of the substrate opposite the first surface and opposite the removable film after depositing the die attach material around the at least one die such that the second surface of the substrate and the die attach material form a substantially planar surface.
4 more elements
A method of attaching a die to a substrate, the method comprising:
- forming a plurality of cavities in a substrate, each of the plurality of cavities extending from a first surface of the substrate to a second surface of the substrate opposite the first surface;
- applying a removable film to the first surface of the substrate;
- positioning one or more die within each of the plurality of cavities such that each die adheres to the removable film and an active surface of each die physically contacts and faces the removable film;
- and
- depositing a die attach material around each of the dies and in each of the plurality of cavities to form a mechanical bond between the die and the substrate;
- planarizing the die attach material and the second surface of the substrate after depositing the die attach material around each of the dies such that the second surface of the substrate and the die attach material form a substantially planar surface.
3 more elements
Dependencies are inferred from the claim text.