Semiconductor package including an extended bandwidth

A semiconductor package comprising:

• a first semiconductor chip including:
• a bottom surface:
• first normal pads electrically coupled to first input/output circuits over the bottom surface of the first semiconductor chip;
• and
• first dummy pads located over the bottom surface of the first semiconductor chip;
• a second semiconductor chip stacked over the first semiconductor chip, the second semiconductor chip including:
• a bottom surface;
• first normal pads electrically coupled to first input/output circuits over the bottom surface of the second semiconductor chip;
• and
• first dummy pads located over the bottom surface of the second semiconductor chip;
• first through electrodes passed through the first semiconductor chip, and electrically coupled to the first dummy pads of the first semiconductor chip and the first normal pads of the second semiconductor chip;
• and
• a substrate configured to support the bottom surface of the first semiconductor chip, and including first coupling pads electrically coupled with the first normal pads and the first dummy pads of the first semiconductor chip, respectively.