Chip package having sensing element and method for forming the same
AssigneeXintec Inc.
InventorsYu-Ting Huang, Tsang-Yu Liu
Life of this patent
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Abstract
A chip package for a sensing element. The chip package includes a substrate having a first surface and a second surface, and a sensing layer having a sensing region disposed on the first surface of the substrate. A conducting pad structure is disposed on the substrate and electrically connected to the sensing region, and a spacer layer is disposed on the first surface of the substrate. A semiconductor substrate is place on the spacer layer. The semiconductor substrate, the spacer layer, and the substrate together surround a cavity on the sensing region. A through-hole extends from a surface of the semiconductor substrate toward the substrate, and connects to the cavity.
Claims20
A chip package, comprising:
- a substrate having a first surface and a second surface;
- a sensing layer disposed on the first surface of the substrate, wherein the sensing layer has a sensing region;
- a conducting pad structure disposed on the substrate and electrically connected to the sensing region;
- a spacer layer disposed on the first surface of the substrate;
- a semiconductor substrate placed on the spacer layer, wherein the semiconductor substrate, the spacer layer, and the substrate together surround a cavity on the sensing region;
- and
- a through-hole extending from a surface of the semiconductor substrate toward the substrate, wherein the through-hole connects to the cavity.
A method for forming a chip package, comprising:
- providing a substrate having a first surface and a second surface, wherein a sensing layer having a sensing region is disposed on the first surface of the substrate, and a conducting pad structure is disposed on the substrate and electrically connected to the sensing region;
- providing a semiconductor substrate;
- placing the semiconductor substrate on the substrate and placing a spacer layer between the substrate and the semiconductor substrate, wherein the semiconductor substrate, the spacer layer, and the substrate together surround a cavity on the sensing region;
- and
- forming a through-hole extending toward the substrate, wherein the through-hole is connected to the cavity.
Dependencies are inferred from the claim text.