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US 9,177,904 B2Granted
Chip-on-film package and device assembly including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJae-Min Jung, Sang-Uk Han, KwanJai Lee, KyongSoon Cho, Jeong-Kyu Ha
Life of this patent
Estimating the term…
Abstract
Chip-on-film packages and device assemblies including the same may be provided. The device assembly includes a film package including a semiconductor chip, a panel substrate connected to one end of the film package, a display panel disposed on the panel substrate, and a controlling part connected to another end of the film package. The film package includes a film substrate, a first wire disposed on a top surface of the film substrate, and a second wire disposed on a bottom surface of the film substrate.
Claims12
A device assembly comprising:
- a film package including,
- a semiconductor chip,
- a film substrate having a U-shape at at least one end thereof,
- a first wire on a top surface of the film substrate, the first wire including a first portion and a second portion spaced apart from the first portion to expose a portion of the film substrate therebetween, and
- a second wire on a bottom surface of the film substrate;
- a panel substrate connected to one end of the film package;
- and
- a display panel on the panel substrate,
- wherein the first portion of the first wire is adjacent to a bottom surface of the panel substrate and the second portion of the first wire is adjacent to a top surface of the panel substrate.
6 more elements
Dependencies are inferred from the claim text.