Enhanced flip-chip die architecture

A method of packaging a multi-chip electronic device, the method comprising:

• fabricating a split substrate having left and right substrate portions spaced apart from one another by a gap;
• joining the left and right substrate portions by attaching an adhesive to an underside of each substrate portion to bridge the gap and to cover solder ball pads located on the undersides of the split substrate;
• joining a plurality of integrated circuit chips to each other using a flip-chip die attach process;
• attaching a pair of the plurality of integrated circuit chips to the split substrate to form a multi-chip electronic device in which one chip is suspended within the gap, a lower surface of the suspended chip being held substantially above the undersides of the split substrate so a not to contact the adhesive;
• wire-bonding one or more of the pair of the plurality of integrated circuit chips to the split substrate;
• encapsulating the multi-chip electronic device with the adhesive present to protect the solder ball pads from coming into contact with an encapsulant;
• removing the adhesive from the right and left substrate portions;
• and
• attaching solder balls to surfaces of the protected solder ball pads.